Description innovative silver-filled AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 oC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe.
描述 創新的銀填充 AI Technology ME8452-A是ME8452的快速版本，用于快速固化應用程序。這種創新的填充銀的環氧糊狀粘合劑是無溶劑的，可再加工的，并且具有導電性和導熱性。具有出色的靈活性，可用于粘接與高度不匹配的CTE（即氧化鋁對鋁，硅對銅）的材料。 ME8452-A可以在80至100oC的溫度下輕松進行返工，并且由于其能夠與高度不匹配的CTE粘合材料的能力而非常適合大面積管芯附著和基板附著等應用。粘度和觸變性指數均可根據您的實際需要進行修改。 ME8452-A可用于自動針頭分配應用的注射器或廣口瓶中。 1 cc TSI注射器
